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Ksiazki - Informatyczne .pl » informatyka » informatyka 3D Integration: Technology and Applications | Wydawnictwo: john wiley & sons
Autor: p. garrou
Liczba stron: 798
Oprawa: miękka
ISBN: 978-3-527-32034-9
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Czas dostawy: 4 - 6 tygodni (na zamówienie)
Cena detaliczna: 666,75 zł
Nasza cena: 666,80 zł
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Opis 3D Integration: Technology and Applications:
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects.
It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry, before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration.
Spis treści 3D Integration: Technology and Applications:
- 1 Introduction to 3D Integration
- 2 Drivers for 3D Integration
- 3 Overview of 3D Process Technology
- Part I -
- Through Silicon Via Fabrication
- 4 Deep Reactive Ion Etching
- 5 Laser Ablation
- 6 Insulation -
- SiO2
- 7 Insulation -
- Organic Dielectrics
- 8 Copper Plating
- 9 Metallization by chemical vapor deposition of W and Cu
- Part II -
- Wafer Thinning and Bonding Technology
- 10 Fabrication, Processing and Singulation of Thin Wafers
- 11 Overview of Bonding Technologies for 3D Integration
- 12 Chip-to-Wafer and Wafer-to-Wafer Integration Schemes
- 13 Polymer Adhesive Bonding Technology
- 14 Bonding with Intermetallic Compounds
- Part III -
- Integration Processes
- 15 Commercial Activity
- 16 Fraunhofer IZM
- 17 Interconnect Process at the University of Arkansas
- 18 Vertical Interconnection by ASET at Toshiba
- 19 3D Integration at CEA-LETI
- 20 Lincoln Laboratory's Integration Technology
- 21 3D Integration Technologies at IMEC
- 22 Fabrication Using Copper Thermo-Compression Bonding at MIT
- 23 Rensselaer 3D Integration Processes
- 24 3D Integration at Tezzaron Semiconductor Corporation
- 25 3D Integration at Ziptronix, Inc.
- 26 3D Integration at ZyCube Sendai Lab.
- Part IV -
- Design, Performance, and Thermal Management
- 27 Design for 3D Integration at NC State University
- 28 Design for 3D Integration at Fraunhofer IIS-EAS
- 29 Multiproject Circuit Design and Layout in Lincoln Laboratory's 3D Technology
- 30 Computer-aided Design for 3D Circuits at the University of Minnesota
- 31 Electrical Performance of 3D Circuits
- 32 Testing of 3D Circuits
- 33 Thermal Management of Vertically Integrated Packages at IBM Zurich
- Part V -
- Applications
- 34 3D and Microprocessors
- 35 3D Memories
- 36 Sensor Arrays
- 37 Power Devices
- 38 Wireless Sensor Systems -
- The e-CUBES Project
- 39 Conclusions
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